The latest fixtureless technology available for even the most challenging Probe Cards To watch our webinar where we talk about Probe Card Test, please contact us at mktg@seica.com The wafer fabrication is a sequential process that gradually creates the electronic circuit. By simplifying, during the manufacturing process of silicon wafers, several integrated circuits are placed
Starting with the basics and the mechanical designs associated with probe cards and their construction, the very first constraint a user may notice is the size of the cards themselves. Traditional flying probe test area sizes can be a limiting factor, so much so, the probe cards don’t even fit in the test area. To
Following the boost to energy saving and the improved design technology, the LED type components replaced almost any other light source. LED modules can be found in any market sector, starting from Automotive, bringing production levels of this type of boards to unconceivable amounts. Typically we talk about simple boards from a circuitry point of
The new FlyPOD option by Seica allows to connect multiple hardware resources to a mini fixture which is installed directly on one of the flying probes. The complexity and miniaturization of electronic boards leads the market to an increasingly widespread deployment of flying probe testers which are turning from parametric testers into powerful and flexible general
For years the means to test flexible circuits or Flexible Hybrid Electronics (FHE) have varied. From very simple and straight forward continuity and isolation testing seen in traditional printed circuit board (PCB) substrates using grid testers to now flying probe testers offering the end-user/contract manufacturer or original equipment manufacturer (OEM) more flexibility in the production
Seica is pleased to invite you to the Webinar: Full Probe Card Test: Overcome the limits of MLO access, March 18. We will analyze the latest technology available for fixtureless testing of even the most challenging probe cards, through high precision, low impact probing of all types of circuits on all types of materials, including MLOs. Register Now
Seica Inc., Vice President, David Sigillo, will be presenting ‘virtually’ at the Flex Conference & Expo this February exploring the test methodologies relevant to the new age of flexible circuits for 2021. This will be an “on demand” event. You may register to attend by following the link below. https://flex.semi.org/program/fhe-systems-flexible-circuit-testing-methodologies
Seica, Inc., the North American subsidiary of Seica S.p.A., will be exhibiting at the SMTA International, Live Virtual Exposition to be held on September 28 – 30, 2020. This will be a virtual event managed by https://smta.org/mpage/smtai. Attendees can register at this event at the URL listed above and navigate to the Seica, Inc. booth
GOEPEL electronic extends its strategic partnership program GATE (GOEPEL Associated Technical Experts) in the North American market by adding the US-based company Seica Inc. as a new member. Focus of the cooperation will be the development and practical implementation of Embedded JTAG Solutions, as well as enhancements in local support and the integration of GOEPEL electronic’s JTAG
